DieTechExpo 2025

DieTechExpo 2025 will offer a wide assortment from the field of paper converting, diemaking and diecutting, foil stamping & embossing, specialty effects processes for the folding carton, corrugated, print finishing, specialty markets like honeycomb and thermoforming as well as others.

The Technology Forum originated from a simple event held in a hotel, where suppliers could showcase their products at individual tables. Recognizing the potential, the Technology Forum was transformed into a trade fair. For the first time, not only die components but also essential machines like lasers and plotters were on display.

With the upcoming DieTechExpo 2025, the event is taking a logical step forward, enhancing the appeal to die manufacturers’ customers, especially in the packaging and corrugated cardboard sectors. This also encourages the die manufacturers to actively participate as exhibitors. 

This trade fair brings together multiple production stages and is complemented by an exciting program of panel discussions and workshops.